SECOR CHIPS & LIBRARY GMBH
Complexity out.
Speed in.
SECOR standardizes Software-Defined Vehicle (SDV) architecture — from chiplet MCU to OTA updates. Hardware and software are designed together from day one, eliminating silos and creating a seamless ecosystem.
The challenge
Vehicle development takes too long and costs too much.
Today, up to 150 ECUs are developed in isolation and only integrated at the prototype stage — the most expensive point in development. Up to 80% of software must be rewritten for new hardware.
The result: bug lists, endless iterations, and costly delays.
Separate lines of development
Software and hardware come from different suppliers and aren't integrated until the prototype stage. Integration problems are structural — not accidental.
Late detection of errors
Integration issues don't surface until the prototype stage — when changes are most costly. Defects accumulate with each iteration, and time-to-market suffers.
Monolithic chip architecture
Traditional SoC designs lock development teams into rigid silicon architectures. Every new requirement triggers a full qualification cycle from scratch.
Vehicle data remains unused
Data silos, lack of standardization, and high cloud costs are blocking data-driven services. Predictive maintenance stays a concept — not a reality.
The potential in numbers
Lower development and production costs
Thanks to its reusability
Shorter time to market
Through standardized hardware and software modules
More resilient supply chain
Pin- and function-compatible alternatives. Longer service life. Resource-efficient production. A supply chain built to last.
Source: AUTOMOBIL-ELEKTRONIK 05/2025 & 03/2026
The SECOR SDV Ecosystem
One system.
Three components.
Fully integrated.
SECOR brings together standardized hardware, an integrated development environment, and a unified vehicle data platform — all in one seamless ecosystem. No silos. No vendor lock-in. Full OTA capability from the first sprint to the youngtimer.
SECOR SDV LAB
Development board for the SDV
Hardware and software, developed together from day one. Software integration is tested every sprint — catching bugs earlier and accelerating time to market.
SECOR Data Usage
Vehicle Data for Value Creation
SECOR.data.USAGE aggregates vehicle data using the COVESA VSS standard, connecting OTA updates and data-driven services through the SECOR APP STORE.
SECOR Chiplets
Modular MCU architecture
Chiplet-based MCUs replace monolithic SoCs. Configure the feature set as needed — no full restart required every time requirements change.
Positioning within the ecosystem
Why SECOR is the only solution built to meet all requirements.
Other solutions only address specific problems. SECOR is the only provider in the world to standardize hardware and software simultaneously.
| Criterion | State of the Art | Tesla / China Concept | SECOR SDV ECOSYSTEM |
|---|---|---|---|
| E/E Architecture | Individual control unit per component | SDV with zonal architecture – focus on software | Full SDV with zonal architecture – focus on hardware and software |
| Number of ECUs | 100–150 | < 75 | < 75 |
| Wiring Harness Length | 7–10 km | approx. 4–6 km | approx. 4 km |
| Replaceable Microcontrollers | |||
| Long-Life Hardware & Software Updates > 20 Years | |||
| Cross-Generational Software Library (Certified Error-Free Modules) | |||
| Unified API Interface | Partially / potentially | ||
| Supply Chain Resilience | Not resilient | Not resilient | |
| 3rd-Party Software |
The development process
From the initial sprint to the entire vehicle lifecycle.
SECOR.sdv.LAB enables Tier 1 suppliers to cleanly separate legacy ECU components into distinct hardware and software modules. As OEMs begin issuing separate tenders for each, hardware and software can be developed in parallel — jointly, iteratively, and fast.
approx. 36 months before SoP
A New Approach to Tendering
OEMs issue separate RFPs for hardware components and software modules. SECOR.sdv.LAB helps Tier 1 suppliers design each independently — with software built to integrate into the future zonal computer (zonal.CU).
starting on day 1 after the contract is awarded
Integrated development
By running hardware and software development in parallel, SECOR enables integration testing every 14 days. Bugs are caught early in the process — and resolved before they compound.
approx. 24 months before SoP
Seamless integration
Download OTA software directly from the SECOR.app.STORE. Get structured error reports for each Tier 1 module and apply fixes directly in SECOR.sdv.LAB.
From SoP through the entire lifecycle
Software always up to date in the vehicle
OTA updates, data-driven services, and predictive maintenance keep the vehicle current at all times — no recalls, no visits to the repair shop.
Measurable results
What you gain –
concrete and measurable.
Lower development costs
No K-Matrix, software reuse from previous generations, Hardware-in-the-Loop (HiL) instead of Software-in-the-Loop (SiL), standardized APIs, and regular integration tests — all through SECOR.sdv.LAB.
Faster time-to-market
Iterative integration from the first sprint eliminates costly late-stage corrections during prototyping — issues are detected and fixed early.
Supports OTA updates
From the start of vehicle development, prototypes and SECOR.sdv.LAB receive an OTA update every 14 days — keeping all systems on the same, up-to-date software version. Fewer recalls, fewer service appointments.
Supply Chain Security
SECOR standardizes MCU production across three sites simultaneously, making multi-sourcing an architectural principle rather than an afterthought.
The result: lower resource consumption in wiring harnesses and the supply chain, plus extended SDV service life through refurbishment.
A standardized SDV software library, fully compatible with Eclipse SDV open-source standards.
Reliable Technology
SECOR made its debut at IAA Mobility 2025, followed by the world premiere of SECOR.sdv.LAB at embedded world 2026.
Current
SECOR at the 30th Automotive Electronics Congress 2026.
When the automotive industry convenes at AEK — the leading automotive conference — SECOR is in the room.
“Where Automotive Electronics Strategy Is Defined”
Experts in automotive E/E architecture will gather in Ludwigsburg on June 16–17, 2026. SECOR attends for the first time, presenting the world-first SECOR SDV PoC 2.0 — a mobile PoC that marks the first time the SECOR SDV ECOSYSTEM has been demonstrated with 100% Fast Ethernet.
The edge.CU light and power modules were developed to control and power analog devices such as headlights and windshield wipers via Fast Ethernet.
30th Automotive Electronics Congress
June 16 and 17, 2026, in Ludwigsburg
A real vehicle, fully equipped with the SECOR SDV ECOSYSTEM — making its live, on-the-road debut at an automotive industry conference.
Next step - partner
Join us. Help set the standard.
The SECOR SDV Ecosystem isn’t built alone — it’s built with partners who want to actively shape the future of the automotive industry.
OEMs & Tier 1 suppliers
Become a Partner
Bring your components or concept vehicle into the SECOR SDV ECOSYSTEM. Together, we set the standard and lay the groundwork for the next generation of vehicles.
Investors
Invest in the Standard
SECOR is the only provider standardizing hardware and software simultaneously — a patented ecosystem with a clear first-mover advantage. Contact us to discuss investment opportunities.
Software provider
Become part of the ecosystem
Develop functional logic modules for the SECOR SDV APP STORE — brand- and vehicle-agnostic, built on standardized APIs. Develop once. Reach every brand.