Our patent-pending SECOR SDV ECOSYSTEM will significantly reduce the complexity of automotive electronics with standardized chips and a modular software library. This will shorten development times, accelerate market launches, significantly reduce costs for OEMs and optimize the use of resources.
| State of the Art | Domain Concept | Tesla Concept | China Concept | SDV Concept CES 2023 | SECOR SDV CONCEPT | |
|---|---|---|---|---|---|---|
| E/E Architecture | Individual ECU for each component | ECU grouped into domains (Powertrain, Body, Infotainment, …) | SDV light with central computer with OtA update | SDV (Zonal concept with 3-4 zones) | SDV full with zonal concept with focus on HW | SDV full with a zonal concept with a focus on HW & SW |
| Number of ECU in the vehicle | 100 - 150 | appx. 75 | appx. 75 | <75 | <75 | <75 |
| Length of wiring harness | 7-10 km | 5-7 km | 4-6 km | appx. 4-5 km | appx. 4 km | appx. 4 km |
| Interchangeable microcontrollers | ||||||
| Long Life Update HW & SW >20 Years | ||||||
| SW Library Cross-generational (certified, error-free modules) | ||||||
| API interface uniform | Partly | Possibly | Yes | Probably yes | ||
| Supply Chain Resilience | Not resilient | |||||
| 3rd-Party-Software | ||||||
With our SDV architecture, we significantly reduce the structural complexity in control unit topologies and the integration effort by reducing the number of components. This simplifies development, supply chain and lifecycle management – while simultaneously reducing costs.
Our solution is based on a patented, rethought electronics architecture for software-defined vehicles (SDV). It is a quantum leap and creates the basis for standardized modules for the first time – flexible, future-proof and OEM-independent.
SECOR combines standardized hardware components (SoCs, I/O modules) with a reusable, modular software library. This accelerates development processes and enables a genuine platform economy in vehicle construction. Hardware and software are flexibly combined via an API interface and can therefore be added to or replaced independently.
Semiconductors and CPUs that are installed in vehicles are standardized and interchangeable – similar to x86 PCs. Just as IBM once made functionally compatible components usable, we are now revolutionizing the automotive industry.
A modular software library is compatible with SECOR semiconductors. This means that vehicle functions can be integrated flexibly and error-free into any SECOR CPU.
The automotive industry meets in Ludwigsburg for the leading Automotive conference AEK – and SECOR will be there.
Under the motto “Where Automotive Electronics Strategy Is Defined,” automotive industry experts in E/E architecture will gather on June 16/17, 2026.
SECOR is attending for the first time, presenting the world premiere of the SECOR SDV PoC 2.0. The drivable PoC showcases the SECOR SDV ECOSYSTEM for the first time in a 100% Fast Ethernet vehicle. To control and power analog consumers such as headlights, windshield wipers, and more via Fast Ethernet, the edge.CU light and power was developed.
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