Our patent-pending SECOR SDV CONCEPT will significantly reduce the complexity of automotive electronics with standardized chips and a modular software library. This will shorten development times, accelerate market launches, significantly reduce costs for OEMs and optimize the use of resources.
| State of the Art | Domain Concept | Tesla Concept | China Concept | SDV Concept CES 2023 | SECOR SDV CONCEPT | |
|---|---|---|---|---|---|---|
| E/E Architecture | Individual ECU for each component | ECU grouped into domains (Powertrain, Body, Infotainment, …) | SDV light with central computer with OtA update | SDV (Zonal concept with 3-4 zones) | SDV full with zonal concept with focus on HW | SDV full with a zonal concept with a focus on HW & SW |
| Number of ECU in the vehicle | 100 - 150 | appx. 75 | appx. 75 | <75 | <75 | <75 |
| Length of wiring harness | 7-10 km | 5-7 km | 4-6 km | appx. 4-5 km | appx. 4 km | appx. 4 km |
| Interchangeable microcontrollers | ||||||
| Long Life Update HW & SW >20 Years | ||||||
| SW Library Cross-generational (certified, error-free modules) | ||||||
| API interface uniform | Partly | Possibly | Yes | Probably yes | ||
| Supply Chain Resilience | Not resilient | |||||
| 3rd-Party-Software | ||||||
With our SDV architecture, we significantly reduce the structural complexity in control unit topologies and the integration effort by reducing the number of components. This simplifies development, supply chain and lifecycle management – while simultaneously reducing costs.
Our solution is based on a patented, rethought electronics architecture for software-defined vehicles (SDV). It is a quantum leap and creates the basis for standardized modules for the first time – flexible, future-proof and OEM-independent.
SECOR combines standardized hardware components (SoCs, I/O modules) with a reusable, modular software library. This accelerates development processes and enables a genuine platform economy in vehicle construction. Hardware and software are flexibly combined via an API interface and can therefore be added to or replaced independently.
Semiconductors and CPUs that are installed in vehicles are standardized and interchangeable – similar to x86 PCs. Just as IBM once made functionally compatible components usable, we are now revolutionizing the automotive industry.
A modular software library is compatible with SECOR semiconductors. This means that vehicle functions can be integrated flexibly and error-free into any SECOR CPU.
The automotive industry meets in Berlin for the leading SDV conference – and SECOR will be there.
From November 30 to December 2, 2025, Berlin will become the international meeting point for the automotive software community. The Software-Defined Vehicles Conference Europe brings together OEMs, Tier 1 suppliers, research institutes, and software providers to discuss the future of software-defined vehicles. SECOR Chips & Library will be exhibiting.
The conference covers the entire spectrum of SDV development: from software architectures and DevOps to SOTA updates, AI integration, and embedded systems.
The transformation from hardware-centric to software-defined vehicles requires a new semiconductor infrastructure. This is exactly where SECOR’s SDV CONCEPT of modular standard building blocks comes in: standardized chips and IP libraries that enable flexible software integration while reducing complexity.
Visit us at the SECOR booth and discover how our semiconductor platform bridges the gap between traditional automotive hardware and the requirements of software-centric architectures.
You are currently viewing a placeholder content from Vimeo. To access the actual content, click the button below. Please note that doing so will share data with third-party providers.
More InformationYou are currently viewing a placeholder content from YouTube. To access the actual content, click the button below. Please note that doing so will share data with third-party providers.
More InformationYou need to load content from reCAPTCHA to submit the form. Please note that doing so will share data with third-party providers.
More Information