SECOR CHIPS & LIBRARY GMBH

Complexity out.
Speed in.

SECOR standardizes the architecture of the Software-Defined Vehicle (SDV) – from the chiplet MCU to OTA updates. No silos, because hardware and software are designed together from day one. A seamless ecosystem.

The challenge

Vehicle development takes too long and costs too much.

Up to 150 ECUs, developed separately, are only brought together at the prototype stage. Integration begins -the most expensive part of development. Up to 80 % of the software for new hardware must be rewritten. Bug lists. Iterations. Delays.

Separate lines of development

Software (SW) and hardware (HW) come from different suppliers and are not integrated until the prototype stage. Integration problems arise structurally -not by chance.

Late detection of errors

Integration issues usually don't surface until the prototype stage, when making changes is costly. The list of defects grows with each iteration cycle. Time-to-market suffers.

Monolithic chip architecture
Traditional SoC designs tie development teams to rigid silicon architectures. Every new requirement means starting over with a full qualification cycle.
Vehicle data remains unused
Data silos, a lack of standardization, and high cloud costs are hindering the development of data-driven services. Predictive maintenance remains a concept rather than a reality.

The potential in numbers

30%

Lower development and production costs

Thanks to its reusability

50%

Shorter time to market

Through standardized hardware and software modules

2x

A more resilient supply chain

Through pin- and function-compatible alternatives. Longer service life and resource-efficient production

Source: AUTOMOBIL-ELEKTRONIK 05/2025 & 03/2026

The SECOR SDV Ecosystem

One system.
Three components.
Fully integrated.

SECOR combines standardized hardware, an integrated development environment, and a comprehensive vehicle data platform into a seamless ecosystem. No silos. No vendor lock-in. Full OTA capability—from the first sprint to the youngtimer.

SECOR SDV LAB

Development board for the SDV

Hardware and software. Developed together from the very beginning. Software integration testing every sprint. Fewer bugs. Faster time to market.

SECOR Data Usage

Vehicle Data for Value Creation

SECOR.data.USAGE aggregates vehicle data based on the COVESA VSS and integrates OTA updates with data-driven services in the SECOR APP STORE.

SECOR Chiplets

Modular MCU architecture

Chiplet-based MCUs instead of monolithic SoCs. Configure the feature set as needed without having to reboot every time requirements change.

Positioning within the ecosystem

Why SECOR is the only solution, that meets all requirements.

All other solutions address only specific issues. SECOR is the only provider in the world to standardize both hardware and software simultaneously.

CriterionState of the ArtTesla / China ConceptSECOR SDV ECOSYSTEM
E/E ArchitectureIndividual control unit per componentSDV with zonal architecture –
focus on software
Full SDV with zonal architecture –
focus on hardware and software
Number of ECUs100–150< 75< 75
Wiring Harness Length7–10 kmapprox. 4–6 kmapprox. 4 km
Replaceable Microcontrollers
Long-Life Hardware & Software Updates
> 20 Years
Cross-Generational Software Library
(Certified Error-Free Modules)
Unified API InterfacePartially / potentially
Supply Chain ResilienceNot resilientNot resilient
3rd-Party Software

The development process

From the initial sprint to the entire vehicle lifecycle.

SECOR.sdv.LAB enables Tier 1 suppliers to cleanly separate legacy components with ECUs into hardware components and software modules. In the future, OEMs will issue separate tenders for both. Software and hardware run in parallel from the outset and are developed jointly, iteratively, and rapidly.

approx. 36 months before SoP

A New Approach to Tendering

OEMs issue separate requests for proposals for hardware components and software modules. SECOR.sdv.LAB supports Tier 1 suppliers in designing the componentshardware separate from the software, which will in future be integrated into the zonal computer (zonal.CU).

starting on day 1 after the contract is awarded

Integrated development

Hardware and software run in parallel. Software integration tests are conducted every 14 days. Bugs are identified early – and fixed early.

approx. 24 months before SoP

Seamless integration

Download OTA software directly from the SECOR.app.STORE. Structured error lists for each Tier 1 module. Apply fixes directly in SECOR.sdv.LAB.

From SoP through the entire lifecycle

Software always up to date in the vehicle

OTA updates, data-driven services, predictive maintenance. The vehicle stays up to date at all times – no recalls, no trips to the repair shop.

Measurable results

What you gain –
concrete and measurable.

30%

Lower development costs

Noneof K-Matrix, reuse of the softwaresoftware from the previous, noe SW in the Loop (SiL), but youekt HW-in-the-Loop (HiL), standardized APIs, and regular integration tests with the SECOR.sdv.LAB.

50%

Faster time-to-market

Iterative integration starting with the first sprint eliminates the need for late, costly rounds of corrections during the prototyping phase, eearly detectiondetection and correction.

100%

Supports OTA updates

Starting from the beginning of the vehicle development process, the prototypes and the SECOR.sdv.LAB receive an OTA update every 14 days. This ensures that all systems are running the same, up-to-date software version. Fewer recalls, fewer service appointments.

Resilient

Supply chain security

Standardized MCUs from three production sites simultaneously. Multi-sourcing as an architectural principle.

Reduced resource consumption for wiring harnesses and the supply chain. Extended service life of the SDV through refurbishment.

Open
Compatible with Eclipse SDV

Standardized SDV software library, compatible with Eclipse SDV open-source standards.

Patent

Reliable technology

Making its debut at IAA Mobility 2025. World premiere iof the SECOR.sdv.LAB at embedded world 2026.

Current

SECOR at the 30th Automotive Electronics Congress 2026.

The automotive industry is gathering for the leading automotive conference, AEK – and SECOR is there.

“Where Automotive Electronics Strategy Is Defined”

Under this theme, experts in automotive E/E architecture will gather in Ludwigsburg on June 16–17, 2026. SECOR will be attending for the first time and will present its world-first SECOR SDV PoC 2.0.

The mobile PoC marks the first time the SECOR SDV ECOSYSTEM has been presented with 100% Fast Ethernet. edge.CU light and power were developed to control and power analog devices such as headlights and windshield wipers via Fast Ethernet.

AEK Logo Color Pos

30th Automotive Electronics Congress

June 16 and 17, 2026, in Ludwigsburg

April 30, 2026 SECOR Samurai Rendert

A real vehicle equipped with a fully implemented SECOR SDV ECOSYSTEM – making its live, on-the-road debut at an automotive industry conference.

Next step - partner

Join us. Help set the standard.

The SECOR SDV Ecosystem isn’t being built on its own – it’s being built with partners who want to actively shape the transformation of the automotive industry.

OEMs & Tier 1 suppliers

Become a Partner

Bring your components or concept vehicle into the SECOR SDV ECOSYSTEM. Together, we’ll set the standard – and lay the groundwork for the next generation of vehicles.

Investors

Invest in the Standard

SECOR is the only provider to standardize both hardware and software simultaneously -a patented ecosystem with a clear first-mover advantage. Contact us to discuss investment opportunities.

Software provider

Become part of the ecosystem

Develop functional logic modules for the SECOR SDV APP STORE – brand- and vehicle-agnostic, based on standardized APIs. Develop once. Reach all brands.