Complexity out. Speed in.

We are building the architecture of the Software-Defined Vehicle.

SECOR Chips & Library GmbH stands for an SDV ecosystem that reduces development costs by up to 30%, shortens time-to-market by up to 50%, and makes supply chains more resilient —because we integrate hardware, software, and vehicle data from day one.

Who We Are

An independent company.
A clear mission.

SECOR Chips & Library GmbH is developing the underlying technical architecture for the software-defined vehicle: a chiplet-based MCU architecture, a unified development environment for hardware and software, and a standardized approach to vehicle data usage.

Our goal is simple to describe but challenging to achieve: We are making vehicle development as modular as the IT industry has long since demonstrated.

We are part of the SECOR Group, headquartered in Gräfelfing near Munich. As an independent company, we focus exclusively on the SECOR SDV Ecosystem—the standardization of chiplets, development processes, and vehicle data for software-defined vehicles.

Why We Exist

Integration should come first. Not on the more expensive end.

Today, up to 150 control units per vehicle are developed separately—software here, hardware there, often by different suppliers. It is not until the prototype stage that these two worlds come together for the first time.

What follows are costly integration loops, growing lists of defects, and schedule delays just before a vehicle is set to go into production. At the same time, traditional, monolithic chip designs tie development teams to rigid silicon architectures—every new requirement means a complete restart, including a new qualification cycle. And due to a lack of standardization, the data generated by a vehicle during operation usually goes unused.

SECOR Chips & Library was founded to address this very issue: We move integration to the beginning of the development process—not to its more expensive final stages.

Our Principle

“Complexity out. Speed in.” is more than just a slogan to us. It is our development principle, applied to every single component of the SECOR SDV ECOSYSTEM.

Why SECOR Is Different

A Third Way.
Instead of a compromise.

Traditional chip suppliers provide monolithic SoCs, which require a complete redesign every time a new requirement arises. Traditional software suppliers develop their solutions separately from the hardware and do not integrate them into the prototype until late in the development process. Existing SDV platform concepts are optimized for a closed software stack—not for an open, interchangeable supplier ecosystem.

SECOR is pursuing a third way

A temperature sensor on the electric motor of an SDV detects an elevated reading that falls outside the defined tolerance range. The SECOR ECOSYSTEM processes this event fully automatically:

A modular silicon approach instead of monolithic SoCs

Chiplets can be swapped out without having to re-qualify the entire architecture.

Early Integration Rather Than Late Convergence

Hardware and software run in parallel from day one, with integration tests every two weeks instead of a single critical prototype phase.

Standardized Data Use Instead of Data Silos

Vehicle data follows an open standard (COVESA VSS) rather than proprietary, isolated solutions—this is what makes third-party apps and predictive maintenance possible.

What We Do

Three building blocks.
A seamless ecosystem.

Our SECOR SDV ECOSYSTEM consists of three coordinated components that complement each other throughout the entire development process—from the request for proposal to the over-the-air update.

Development

SECOR SDV LAB

A shared development environment in which hardware and software teams work in parallel from day one—with regular integration tests every two weeks instead of a single, late integration phase.

Hardware

SECOR Chiplets

A chiplet-based MCU architecture instead of monolithic SoCs. Modules can be flexibly configured and swapped out without requiring a complete redesign—which makes supply chains more resilient.

Data

SECOR Data Usage

Standardized aggregation of vehicle data based on the COVESA-VSS standard, combined with an app store for over-the-air updates. This turns the vehicle into a platform.

SECOR Team

Over 25 years of experience in theautomotive industry.

SECOR Chips & Library is led by a team of experienced automotive and technology experts, supported by an advisory board with decades of experience at OEMs, Tier 1 suppliers, and international consulting firms.

CEO & Managing Director

Dr. Hartwig Schwerdtle

Over 25 years of experience in automotive OEM management at Mercedes-Benz, BMW, and Audi, as well as many years of experience on the VDA Semiconductor Committee.

CTO, Managing Director & Founder

Klaus Jungbauer

Over 30 years of professional experience in IT, with a focus on architecture and database systems as well as software performance.

You can find complete profiles of the executive team and the advisory board on our Management page.

Location

Based near Munich.
Operating worldwide.

Secor Standorte
Munich

SECOR Group GmbH
Schmidbauerstraße 4
82166 Gräfelfing
Germany

+49 89 99 75 13 07
info@secor-cl.com

Boston

SECOR Representative Office, Americas
24 Marshall Rd.
Wellesley, MA 02482, USA

+1 617 669 7075
info@secor-cl.com

Tokyo

SECOR Representative Office in Japan

3-24-5, Shinmachi, Setagaya-ku
Tokyo,
Japan

+81 80-56973216
saki.nakajima@secor-cl.com

Seoul

SECOR Representative Office, South Korea
22, Jamsil-dong, Songpagu
Seoul
South Korea

+82 10 41 28 08 17
jimmy.kim@secor-cl.com

DE

SECOR Chips & Library, Inc.

Schmidbauer Street 4
82166 Gräfelfing/Munich

US

Representative Office in the United States

24 Marshall Rd.
02482 Wellesley, MA

JA

Representative Office in Japan

3-24-5, Shinmachi, Setagaya-ku
Tokyo

KO

Representative Office in South Korea

22, Jamsil-dong, Songpa-gu
82166 Seoul

Your Next Step

Discover the SECOR SDV Ecosystem.

Whether you’re an OEM, a Tier 1 supplier, an investor, or a software provider—we look forward to discussing the future of vehicle architecture with you.