CHIPLET architecture for the SDV
From monolithic SoCs to configurable MCU architectures.
Traditional SoC designs lock microprocessor development teams into a fixed silicon architecture. More computing power or new peripherals? Start from scratch — a full greenfield approach. Chiplet-based MCU architectures break this cycle.
our USP
Chiplets, not SoC
- Modular MCUs instead of monolithic SoCs – Configure the feature set as needed
- Combining various manufacturing technologies into a single unit (microprocessor)
- Scalable product families based on identical chiplet modules
- Faster response to new specifications without a new chip architecture
Challenge
Why traditional SoC designs slow down development teams.
Monolithic chip architectures lock OEMs and Tier 1 developers into rigid silicon designs – every new requirement means starting from scratch.
The bottleneck runs deeper than the software
When performance requirements, manufacturing nodes, or peripheral interfaces change, the monolithic SoC becomes a bottleneck — everything is integrated into a single die. Any new requirement means a new chip, with a full development and qualification cycle. In the SDV environment, that time and budget simply aren’t available.
Modular MCUs instead of monolithic SoCs
Chiplets are individual, specialized semiconductor dies connected electrically via a common interposer. The result is an MCU whose feature set, computing power, and manufacturing process can be specifically configured — rather than fixed from the start.
Mix of technologies within a unit
Because chiplets are manufactured independently, different process technologies can be combined within a single MCU — high-performance digital processing cores alongside robust analog components, without compromising either.
Modular, scalable product families
The same chiplet modules can be combined in different numbers and configurations to produce variants from entry-level to high-end. Development and qualification happen once — at the chiplet level — not separately for each product variant.
Faster response to new requirements
New specifications don’t require a new chip architecture — just a new configuration of the existing modular system. This significantly shortens the path from requirement to qualified hardware.
How it works – step by step
The Chiplet Architecture:
A modular system instead of a one-off design.
SECOR.sdv.LAB enables Tier 1 suppliers to cleanly separate legacy ECU components into distinct hardware and software modules. As OEMs begin issuing separate tenders for each, hardware and software can be developed in parallel — jointly, iteratively, and fast.
building block
The chiplet – the specialized individual component
A chiplet is a single, specialized semiconductor die with a clearly defined set of functions—such as digital processing cores or analog measurement and signal processing. It is manufactured using the process node that is optimal for its function.
Chiplets are developed and qualified once — then reused across any number of MCU configurations.
Organizer
The interposer – the connecting base
The interposer is the substrate that electrically connects multiple chiplets. It manages communication between dies and the outside world — like a highly integrated circuit board within a single package.
Together, the interposer and chiplets form the MCU — flexibly configured, delivered as a compact unit.
Config-
uration
The configured MCU – from entry-level to high-end
By varying the number and selection of chiplets, an entire product family can be built from the same building blocks — 4, 8, 16, 32, or 64 cores, depending on requirements. New performance classes don’t need a new architecture, just a new combination.
With the same modular architecture and identical chiplets, everything from entry-level models to high-performance units can be built — no separate designs needed.
Benefits at a glance
What you gain -
concrete and measurable.
Chiplet architecture isn’t just a concept—it is fundamentally transforming the economics of MCU development.
Cores per MCU
Clear performance tiers based on identical chiplet modules—without a new architecture
Qualification per chiplet
One-time development and certification—then recombinable indefinitely
Product variants
From entry-level to high-end models, all based on the same modular design
The structural advantages of chiplet architecture.
Modular building blocks instead of rigid silicon—this is how chiplet architecture is transforming every step of the development process.
Interposer-based architecture
Chiplets are electrically connected on a common substrate and supplied as a compact MCU unit.
Mixed-Technology Integration
Multiple processing units in one MCU — high-performance digital cores alongside robust analog components.
Scalable product families
Future-proof SDV architecture
New requirements do not call for a new chip architecture—but rather a new configuration of the existing modular system.
Open-source compatibility
Compatible with Eclipse SDV open-source standards and existing development infrastructures.
Resilient supply chain
Standardized, universally compatible semiconductor components from multiple sources—no proprietary lock-in.
Your Next Step
Ready to rethink the chip architecture for your next SDV project?
SECOR develops chiplet-based MCU architectures for the Software-Defined Vehicle — scalable, open, and built for Tier 1 development teams. Fraunhofer IIS is currently developing an MCU design study, with next steps being taken in parallel with imec Germany and others.
Talk to us.